EP1AGX35 datasheet(27/182 Pages) ALTERA

Part #	EP1AGX35

Description	Package Information Datasheet for Mature Altera Devices

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Manufacturer	ALTERA [Altera Corporation]

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Package Information Datasheet for Mature Altera Devices

27

Thermal Resistance

Altera Corporation

Package Information Datasheet for Mature Altera Devices

Cyclone Series Devices Thermal Resistance

Table 29 to Table 30 provide thermal resistance values for Cyclone series devices.

Cyclone II Devices

Table 29 lists the thermal resistance of Cyclone II devices.

Device

Package

Pin Count



JC (° C/W)



JA (° C/W)

Still Air



JA (° C/W)

100 ft./min.



JA (° C/W)

200 ft./min.



JA (° C/W)

400 ft./min.

EP1S30

FBGA,

Flip Chip

780

0.2

10.4

8.4

7.0

5.9

BGA,

Flip Chip

956

0.2

9.1

7.1

5.8

4.8

FBGA,

Flip Chip

1020

0.2

9.9

7.9

6.5

5.4

EP1S40

FBGA,

Flip Chip

780

0.2

10.4

8.3

6.9

5.8

BGA,

Flip Chip

956

0.2

9.0

7.0

5.7

4.7

FBGA,

Flip Chip

1020

0.2

9.8

7.8

6.4

5.3

FBGA,

Flip Chip

1508

0.2

9.1

7.1

5.8

4.7

EP1S60

BGA,

Flip Chip

956

0.1

8.9

6.9

5.6

4.6

FBGA,

Flip Chip

1020

0.1

9.7

7.7

6.3

5.2

FBGA,

Flip Chip

1508

0.1

8.9

7.0

5.6

4.6

EP1S80

BGA,

Flip Chip

956

0.1

8.8

6.8

5.5

4.5

FBGA,

Flip Chip

1020

0.1

9.6

7.6

6.2

5.1

FBGA,

Flip Chip

1508

0.1

8.8

6.9

5.5

4.5

Table 28. Thermal Resistance of Stratix Devices (Part 2 of 2)

Table 29. Thermal Resistance of Cyclone II Devices (Part 1 of 2)

Device

Package

Pin Count



JC (° C/W)



JA (° C/W)

Still Air



JA (° C/W)

100 ft./min.



JA (° C/W)

200 ft./min.



JA (° C/W)

400 ft./min.

EP2C5

TQFP,

Wire Bond

144

10.0

31.0

29.3

27.9

25.5

PQFP,

Wire Bond

208

5.5

30.4

29.2

27.3

22.3

FBGA,

Wire Bond

256

8.7

30.2

26.1

23.6

21.7

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