NX3008PBK

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Product data sheet

Rev. 1 — 1 August 2011

11 of 16

NXP Semiconductors

NX3008PBK

30 V, 230 mA P-channel Trench MOSFET

9.

Package outline

Fig 18. Package outline SOT23 (TO-236AB)

UNIT

max.

cD

E

Qw

v

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

04-11-04

06-03-16

IEC

JEDEC

JEITA

mm

0.1

0.48

0.38

0.15

0.09

3.0

2.8

1.4

1.2

0.95

e

1.9

2.5

2.1

0.55

0.45

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23

TO-236AB

bp

D

e1

e

A

A1

Lp

Q

detail X

HE

E

B

A

B

0

1

2 mm

scale

A

1.1

0.9

c

X

12

3

Plastic surface-mounted package; 3 leads

SOT23