CYStech Electronics Corp.

Spec. No. : C753SA

Issued Date : 2006.07.13

Revised Date :2013.05.22

Page No. : 6/6

SK2XSA

CYStek Product Specification

SMA/DO-214AC Dimension

Marking :

Device

SK22SA SK24SA SK26SA

Code

SK22

SK24

SK26

Device

SK28SA SK2BSA

Code

SK28

SK2B

SMA/DO-214AC Plastic

Surface Mounted Package

CYStek Package Code : SA

*:Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.055

0.062

1.40

1.60

E

0.006

0.012

0.152

0.305

B

0.098

0.114

2.50

2.90

F

0.002

0.008

0.051

0.203

C

0.157

0.181

4.00

4.60

G

0.030

0.060

0.76

1.52

D

0.078

0.096

2.00

2.44

H

0.188

0.208

4.80

5.28

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : Pure tin plated.

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.