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DCR1002SF10 Datasheet(PDF) 6 Page - Dynex Semiconductor |
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DCR1002SF10 Datasheet(HTML) 6 Page - Dynex Semiconductor |
6 / 9 page 6/9 www.dynexsemi.com DCR1002SF Fig.6 Gate characteristics 10 1 0.1 0.01 0.001 Gate trigger current, IGT - (A) 100 10 1 0.1 Region of certain triggering Upp er limit 95% Lower limit 5% VGD 100 200 500 1ms 10ms Frequency Hz 50 150 150 150 150 20 100 150 150 150 50 - 400 150 125 100 25 - Pulse width µs Table gives pulse power PGM in Watts 0.1 0.01 0.001 0.001 0.01 0.1 1.0 10 Time - (s) Anode side cooled Double side cooled Conduction Effective thermal resistance Junction to case ˚C/W Double side 0.018 0.021 0.022 0.025 Anode side 0.036 0.038 0.040 0.043 d.c. Halfwave 3 phase 120˚ 6 phase 60˚ Fig.6 Transient thermal impedance - junction to case Fig.4 Stored charge Fig.5 Reverse recovery current 0.1 1.0 10 100 Rate of decay of on-state current, dI/dt - (A/µs) 10000 1000 100 Conditions: IT = 1000A, VR = –100V, T j = 125˚C Q S is total integral stored charge IRR QS IT dI/dt Max QS Min QS 0.1 1.0 10 100 Rate of decay of on-state current, dI/dt - (A/µs) 10000 1000 100 Conditions: IT = 1000A, VR = –100V, T j = 125˚C Max I RR Min I RR |
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