54HSC/T630

7/10

PIN ASSIGNMENTS

Figure 7: 28-Lead Ceramic DIL (Solder Seal)

- Package Style C

Figure 8: 28-Lead Flatpack (Solder Seal) - Package Style F

PACKAGE OUTLINES

Figure 9: 28-Lead Ceramic DIL (Solder Seal) - Package Style C

D

W

A

e

b

Z

H

15°

M

E

C

Seating Plane

1

14

28

15

Ref

Millimetres

Inches

Min.

Nom.

Max.

Min.

Nom.

Max.

A

-

-

5.715

-

-

0.225

A1

0.38

-

1.53

0.015

-

0.060

b

0.35

-

0.59

0.014

-

0.023

c

0.20

-

0.36

0.008

-

0.014

D

-

-

36.02

-

-

1.418

e

-

2.54 Typ.

-

-

0.100 Typ.

-

e1

-

15.24 Typ.

-

-

0.600 Typ.

-

H

4.71

-

5.38

0.185

-

0.212

Me

-

-

15.90

-

-

0.626

Z

-

-

1.27

-

-

0.050

W

-

-

1.53

-

-

0.060

XG404