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CZTUX87 Datasheet(PDF) 1 Page - Central Semiconductor Corp

Part No. CZTUX87
Description  NPN - High Voltage Transistor Chip
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Maker  CENTRAL [Central Semiconductor Corp]
Homepage  http://www.centralsemi.com
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GEOMETRY
PROCESS DETAILS
PRINCIPAL DEVICE TYPE
CZTUX87
GROSS DIE PER 5 INCH WAFER
2,500
PROCESS CP250
Power Transistor
NPN - High Voltage Transistor Chip
BACKSIDE COLLECTOR
Die Size
99 x 69 MILS
Die Thickness
11.6 MILS
Base Bonding Pad Area
18 x 21 MILS
Emitter Bonding Pad Area
18 x 26 MILS
Top Side Metalization
Al-Si - 60,000Å
Back Side Metalization
Ti/Ni/Au - 5,500Å
R0
B
E
www.centra lsemi.com
R0 (19-July 2010)




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