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CZT651 Datasheet(PDF) 1 Page - Central Semiconductor Corp

Part No. CZT651
Description  NPN - High Current Transistor Chip
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Maker  CENTRAL [Central Semiconductor Corp]
Homepage  http://www.centralsemi.com
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GEOMETRY
PROCESS DETAILS
PRINCIPAL DEVICE TYPES
CBCP68
CBCX68
CMPT651
CZT651
MPS650
MPS651
GROSS DIE PER 5 INCH WAFER
10,583
PROCESS CP314V
Small Signal Transistor
NPN - High Current Transistor Chip
Process
EPITAXIAL PLANAR
Die Size
40 x 40 MILS
Die Thickness
7.1 MILS
Base Bonding Pad Area
7.9 x 8.7 MILS
Emitter Bonding Pad Area
9.0 x 14 MILS
Top Side Metalization
Al - 30,000Å
Back Side Metalization
Au-As - 13,000Å
www.centra lsemi.com
R1 (22-March 2010)




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