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P6SMB8.2A Datasheet(PDF) 1 Page - Cystech Electonics Corp. |
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P6SMB8.2A Datasheet(HTML) 1 Page - Cystech Electonics Corp. |
1 / 5 page CYStech Electronics Corp. Spec. No. : C766SB Issued Date : 2009.05.18 Revised Date : Page No. : 1/5 P6SMB6.8A thru P6SMB550CA CYStek Product Specification Surface Mount Transient Voltage Suppressors Peak Pulse Power 600W Breakdown Voltage 6.8 to 550V P6SMB6.8A thru P6SMB550CA Features Outline • Low profile package with built-in strain relief for surface mounted DO-214AA (SMB) applications • Plastic package has UL flammability classification 94V-0 • Very-fast response time • Excellent clamping capability • Low incremental surge resistance • Glass passivated junction • High temperature soldering guaranteed: 250°C/10seconds at terminals • 600W peak pulse power capability with a 10/1000μs waveform, repetition rate (duty cycle) : 0.01% Mechanical Data • Case : JEDEC DO-214AA(SMB) molded plastic body • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026 • Polarity: For uni-directional types, the band denotes the cathode, which is positive with respective to the anode under normal TVS operation • Weight: 0.003 oz., 0.093 gram Devices for bidirectional applications For bi-directional devices, use suffix CA (e.g. P6SMB10CA). Electrical characteristics apply in both directions. Maximum Ratings and Characteristics(TA=25 °C, unless otherwise noted) Parameter Symbol Value Unit Peak power dissipation with a 10/1000μs waveform (Fig. 1) PPPM Minimum 600 (Note 1, 2) W Peak pulse current with a 10/1000μs waveform (Note 1) IPPM See next table A Power dissipation on infinite heatsink, TA=50°C PM(AV) 5 W Peak forward surge current, 8.3ms single half sine wave uni-directional only (Note 2) IFSM 100 A Typical thermal resistance, junction-to-leads RθJL 20 °C/W Typical thermal resistance, junction-to-ambient (Note 3) RθJA 100 °C/W Operating junction and storage temperature range TJ;TSTG -55 ~ +150 °C Notes: 1.Non-repetitive current pulse, per Fig. 3 and derated above TA=25°C per Fig. 2 2.Mounted on 0.2”×0.2” (5mm×5mm) copper pads to each terminal 3.Mounted on minimum recommended pad layout |
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