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BD3575FP Datasheet(PDF) 5 Page - Rohm |
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BD3575FP Datasheet(HTML) 5 Page - Rohm |
5 / 12 page Technical Note 5/9 BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP www.rohm.com 2011.03 - Rev.B © 2011 ROHM Co., Ltd. All rights reserved. ●Output Voltage Adjustment To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins, and pull-up resistor R2 between the VO and ADJ pins. Vo = VADJ×(R1+R2) / R1 [V] {VADJ=1.26V(TYP.)} The recommended connection resistor for the ADJ-GND is 30k~150kΩ. ●Setting of Heat TO252-3 TO252-5 HRP5 Fig. 23 Fig. 24 Fig. 25 Refer to the heat mitigation characteristics illustrated in Figs. 23, 24 and 25 when using the IC in an environment where Ta ≧25℃. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the maintenance of the reliability of the IC in long-time operation. In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction temperature Tjmax. Fig. 23 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate the IC within the power dissipation Pd. The following method is used to calculate the power consumption PC (W). Vcc : Input voltage PC=(VCC-VO)×IO+VCC×ICC Vo : Output voltage Power dissipation Pd≦PC Io : Load current Icc : Total supply current The load current IO is obtained to operate the IC within the power dissipation. (For more information about ICC, see page 12.) The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process. ●Calculation example Example: BD3571FP VCC = 12 V and VO = 5 V at Ta = 85℃ IO≦89mA (ICC=30μA) Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the power dissipation. The power consumption Pc of the IC in the event of shorting (i.e., if the VO and GND pins are shorted) will be obtained from the following equation. Pc=VCC×(ICC+Ishort) Ishort = Short current VCC-VO Io≦ Pd-VCC×ICC IO≦ 0.624-12×ICC 12-5 θja=104.2℃/W→-9.6mAW/℃ 25℃=1.2W→85℃=0.624W 0 0.4 1.2 W 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 104.2 (°C/W) AMBIENT TEMPERATURE: Ta [°C] 0 0.4 1.6 W 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 78.1 (°C/W) AMBIENT TEMPERATURE: Ta [°C] 0 0.4 1.3W 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 96.2 (°C/W) Fig.22 ADJ Vo R2 R1 |
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