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BCX52-10-115 Datasheet(PDF) 6 Page - NXP Semiconductors

Part No. BCX52-10-115
Description  PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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BCX52-10-115 Datasheet(HTML) 6 Page - NXP Semiconductors

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BCP52_BCX52_BC52PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 18 October 2011
6 of 22
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4]
Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5]
Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
BCP52
[1] --
192
K/W
[2] --
125
K/W
[3] --
93
K/W
BCX52
[1] --
250
K/W
[2] --
132
K/W
[3] --
93
K/W
BC52PA
[1] --
298
K/W
[2] --
151
K/W
[3] --
114
K/W
[4] --
154
K/W
[5] --
76
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
BCP52
-
-
16
K/W
BCX52
-
-
16
K/W
BC52PA
-
-
20
K/W


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