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BCX52-10-115 Datasheet(PDF) 18 Page - NXP Semiconductors

Part No. BCX52-10-115
Description  PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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BCX52-10-115 Datasheet(HTML) 18 Page - NXP Semiconductors

 
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BCP52_BCX52_BC52PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 18 October 2011
18 of 22
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
Reflow soldering is the only recommended soldering method.
Fig 26. Reflow soldering footprint SOT1061 (HUSON3)
occupied area
solder paste = solder lands
Dimensions in mm
sot1061_fr
solder resist
0.4
2.1
1.3
0.25
0.25
0.25
1.1
1.2
0.55
0.6
2.3
0.5 (2
×)
0.5 (2
×) 0.6 (2×)
0.4 (2
×)
0.5
1.6
1.7
1.05


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