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NSWC104100TRE1F Datasheet(PDF) 1 Page - NIC-Components Corp.

Part No. NSWC104100TRE1F
Description  Stacked Film Capacitor Chips
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Maker  NIC [NIC-Components Corp.]
Homepage  http://www.niccomp.com
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NSWC104100TRE1F Datasheet(HTML) 1 Page - NIC-Components Corp.

   
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®
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Stacked Film Capacitor Chips
NSWC Series
FEATURES
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM
• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES
• WIDE TEMPERATURE RANGE UP TO +125OC*
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
nCHARACTERISTICS
• REFLOW SOLDERING ONLY
• TAPE AND REEL PACKAGING
ENVIRONMENTAL CHARACTERISTICS
RECOMMENDED LAND
PATTERN (mm)
A
B
NSWC IS
RECOMMENDED
FOR NEW DESIGNS
SPECIFICATIONS
Case Sizes
1206
1210
1913
2416
2820
3022
3925
Capacitance Range
0.001 ~ 0.0047
μF 0.0056 ~ 0.01μF 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF
Votage Ratings
100Vdc
Capacitance Tolerance
0.001 ~ 0.01
μF 5% (J) only,
0.012 ~ 0.15
μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only
Temperature Range
-55°C ~ +105°C (0.001
μF ~ 0.01μF)
-55°C ~ +125°C (0.012
μF ~ 1.0μF with derating above +85°C)
Dissipation factor (20°C)
1.0% max. @ 1KHz
Insulation resistance (20°C)
3 Gigohms or 1000
Ω/F whichever is lower
Dielectric Withstanding
Voltage
150% of Rated Voltage 60 Seconds
Life Test At +105°C
1,000 Hours at 125% of Rated Voltage
(125°C for 0.012
μF ~ 1.0μF)
Capacitance Change
Within +1%/-6% of Initial Value
Dissipation Factor
1.1% Maximum
Insulation Resistance
1 Gigohm Minimum or 300
Ω/F whichever is lower
Resistance to Soldering Heat:
+240°C Peak
Capacitance Change
Within ±5% for 0.012 ~ 1.0
μF or ±3% for 0.001 ~ 0.01μF of initial value
Dissipation Factor
1.1% Max. for 0.012 ~ 1.0
μF or 0.66% Max. for 0.001 ~ 0.01μF
Insulation Resistance
1 Gigohm Minimum or 300
Ω/F whichever is lower
Humidity Load Life (90% ~ 95% RH)
(1) 1,000 Hours, +40°C
500 Hours for 0.012
μF ~ 1.0μF
(2) 500 Hours, +60°C
for 0.001 ~ 0.01
μF
Capacitance Change
(1) +8%/-5%
(2) ±10% of Initial Value
Dissipation Factor
(1) 1.5% Max.
(2) 2.0% Max.
Insulation Resistance
(1) 100 Megohm Min. or 30
Ω/F
(2) 10 Megohm Min. or 3
Ω/F
whichever is lower
Solderability with
25% Wt Rosin-Methanol Flux
90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot
EIA Size
A
B
C
1206
1.8
3.6
1.4
1210
1.8
3.6
2.3
1913
2.6
6.6
3.0
2416
3.8
7.8
3.8
2820
4.5
9.0
4.6
3022
5.1
9.7
5.0
3925
7.2
11.9
5.7
NSWC 823 J 100 TR D4 N F
RoHS Compliant
Optional High Temp. Reflow (+250°C)*
Size Code
Tape & Reel
Voltage
Tolerance Code: J = ±5%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
PART NUMBER SYSTEM
*Special packaging and handling required.
RECOMMENDED REFLOW PROFILE
Standard: +240 °C Peak Temperature
+250°C Special Order
(see part numbering system)
50
100
150
200
250
300
Time
Pre-heat
150°C ~ 180°C
120 sec. max.
25
0
Cool Down
Time above 220°C
60 sec. max.
Ramp-up
25°C ~ 150°C
90 sec. max.
*See Part Number System for Details
RoHS
Compliant
includes all homogeneous materials


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