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SCGB2012H121EPF Datasheet(PDF) 5 Page - Socay Electornics Co., Ltd. |
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SCGB2012H121EPF Datasheet(HTML) 5 Page - Socay Electornics Co., Ltd. |
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5 / 5 page  Chip Ferrite Bead Revision February 13, 2014 5 / 5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCGB-H Series SOCAY Electronics Co., Ltd. www.socay.com Test item Test condition Criteria Temperature Cycle a. Temperature : -40 ~ +85℃ b. Cycle : 100 cycles c. Dwell time : 30minutes Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Induction value should be within ±20 % of the initial value Operational Life a. Temperature : 125 ±5 ℃℃ b. Test time : 1000 hrs c. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Induction value should be within ±20 % of the initial value Biased Humidity a. Temperature : 40 ±2 ℃℃ b. Humidity : 90 ~ 95 % RH c. Test time : 1000 hrs d. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Induction value should be within ±20 % of the initial value Resistance to Solder Heat a. Solder temperature : 260 ±5℃ b. Flux : Rosin c. DIP time : 10 ±1 sec a. More than 95 % of terminal electrode should be covered with new solder b. No mechanical damage c. Induction value should be within ±20 % of the initial value Adhesive Test a. Reflow temperature : 245 It shall be Soldered on ℃ the substrate applying direction parallel to the substrate b. Apply force(F) : 5 N Test time : 10 sec a. No mechanical damage b. Soldering the products on PCB after the pulling test force > 5 N Rated Current Test a. Apply current : full rated current / 5min Temperature rise should be less than 25℃ Steam Aging Test a. Temperature : 93℃ b. Test time : 4hrs Others: 8hrs c. Solder temperature : 235 ±5℃ d. Flux : Rosin e. DIP time : 5 ±1 sec More than 95 % of terminal electrode should be covered with new solder Reliability and Test Condition |
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