SG75 datasheet(3/4 Pages) LITTELFUSE

Part #	SG75

Description	Gas Discharge Tube (GDT) Products

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Manufacturer	LITTELFUSE [Littelfuse]

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Gas Discharge Tube (GDT) Products

Specifications are subject to change without notice.

Revised: 11/25/13

SG Series

Reflow Condition

Pb–Freeassembly

Pre Heat

-Temperature Min (T

s(min))

150°C

-Temperature Max (T

s(max))

200°C

-Time (Min to Max) (t

s)

60 – 180 secs

Average ramp up rate (LiquidusTemp

(T

L) to peak

3°C/secondmax

T

S(max) to TL - Ramp-up Rate

5°C/secondmax

Reflow

-Temperature (T

L) (Liquidus)

217°C

-Temperature (t

L)

60 – 150 seconds

PeakTemperature (T

P)

260+0/-5°C

Time within 5°C of actual peak

Temperature (t

p)

10 – 30 seconds

Ramp-down Rate

6°C/secondmax

Time 25°C to peakTemperature (T

P)

8minutesMax.

Do not exceed

260°C

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Time

TP

TL

TS(max)

TS(min)

25

tP

tL

tS

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

TL to TP

Device Dimensions

4.5 +/- 0.3

2.7 +/- 0.3

0.5 +/- 0.1

5.2

2.8

3.2 +/- 0.3

Recommended Soldering Pad Layout

4

Dimensions in Millimeters.

Device Marking

Type

Code

A3A

Production

Year Code

(last digit)

Production

Month Code

Type Code

A

SG75

B

SG90

C

SG150

D

SG230

E

SG300

F

SG300Q

G

SG350

H

SG350Q

I

SG400

J

SG420

K

SG420Q

L

SG450Q

M

SG500Q

N

SG600Q

Month Code

A

January

B

February

C

March

D

April

E

May

F

June

G

July

H

August

I

September

J

October

K

November

L

December

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