LIA101

www.clare.com

5

Rev. X

Dimensions

mm

(inches)

Mechanical Dimensions

7.493

± .051

(.295

± .002)

7.493

± .127

(.295

± .005)

.254

(.010)

1.270 TYP.

(.050)

2.108 MAX.

(.083)

1.981 TYP.

(.078)

1.016

(.040)

10.363

± .127

(.408

± .005)

8.890 TYP.

(.350)

.406 TYP.

(.016)

10.160

± .051

(.400

± .002)

16 Pin SOIC (“P” Suffix)

PC Board Pattern

(Top View)

1.193

(.047)

9.728

± .051

(.383

± .002)

.787

(.031)

1.270

(.050)

Tape and Reel Packaging for 16 Pin SOIC Package

7.493

± .102

(.295

± .004)

12.090

(.476)

1.753

± .102

(.069

± .004)

3.987

± .102

(.157

± .004)

1.498

± .102

(.059

± .004)

6.731 MAX.

(.265)

.406 MAX.

(.016)

3.175

(.125)

Top Cover

Tape

2.007

± .102

(.079

± .004)

11.989

± .102

(.472

± .004)

User Direction of Feed

.050R TYP.

16.002

± .305

(.630

± .012)

10.693

± .025

(.421

± .001)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

.102 MAX.

(.004)

10.897

± .025

(.429

± .001)

1.549

± .102

(.061

± .004)

330.2 DIA.

(13.00)

116

6.350

± .127

(.250

± .005)

19.202

± .381

(.756

± .015)

2.540

± .127

(.100

± .005)

9.144 TYP.

(.360)

.457

± .076

(.018

± .003)

17.780

± .127

(.700

± .005)

16 Pin DIP Through Hole (Standard)

7.620 TYP.

(.300)

3.429 TYP.

(.135)

7.620

± .254

(.300

± .010)

9.144 TYP.

(.360)

PC Board Pattern

(Top View)

6.350

± .127

(.250

± .005)

2.540

± .127

(.100

± .005)

7.620

± .127

(.300

± .005)

17.780

± .127

(.700

± .005)

16-.800 DIA.

(16-.031 DIA.)