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0603SFS300F32 Datasheet(PDF) 1 Page - Tyco Electronics |
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0603SFS300F32 Datasheet(HTML) 1 Page - Tyco Electronics |
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1 / 28 page  75 11 Surface-mount Fuses Fundamentals Overview TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping to prevent costly damage and promote a safe environment for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current ratings from .5A up to 20A. TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68), and UL60950 3rd edition. Multi-layer Design for Chip Fuses The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material. When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc. Figure 1 compared the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach. Figure 2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure. Glass/Ceramic Substrate Multiple Fuse Elements Substrate Material Single Fuse Element Single-layer Glass Coated Design Multi-layer Design Glass Coating Figure 1 Figure 2 Fault Zones Multi-layer Design Single-layer Glass Coated Design Wire-In-Air Design for 2410SFV Fuses The 2410(6125) is a Wire-In-Air SMD Fuse which is very suitable for secondary level over current protection applications. Figure 3 compared our straight wire element design 2410SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability. Introduced PCB assembly technology into 2410SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse. Glass fiber enforced epoxy body Ceramic body Corrugate wire element End capplated with Tin Straight wire element Copper terminal plated with Ni and Tin Figure 3 ng to prevent costly damage and nt for electronic and electrical fuses provide performance stability urrent ratings from .5A up to 20A. fers the telecomFT600 fuse for ons. This telecom fuse helps comply current protection requirements, TIA-968-A (formerly FCC Part 68), hip Fuses he benefit of exposing more fffffffuse glass-ceramic absorptio o onma n nm m n m te er e e e e ial. en, there is more mate e e e e e erial fo forth h h h h h he e e orb into, resulting in a in n n v v ver v v v yef e fiic i fi ie en e e e e e ttttt e fuse arc. ayer desi s s si s gn o gn o gn o g g fourSF S SF F F S SF FFffu f ses s s s w w wit w w h h h s.The g g gla g g g g ss sc s s s o oatted d d ed d e e e edde e esi e gns s s s s re e el e yon yon on ofthe e efu e e e se ellem ment ent entt enttt tto a ttt bso o o o o o orb t rb tt rr he e e e e e itop p p p p pens.Th h h h h he e erefo or o o o e, t et e, t e t e e, tthereis s s s mu u uc u u h h h h h h h bleto ttttt abs ab ab ab b ab orb rrb b r the h he fu us fu u u f em e me e m tal a a s. T sT T T T T s. T Th he e e h h h g and d d dp d dp d p d dp pos os ss s s s s ib b bl b e e ecoating b n n n n n re e ea e e e ch. ch ch h h h h orptiio iiii nch nch h n n ara rra acte e e eris rrriii tic ic c c c ii sof offf of of of of the he h he he he he e two desig g g gn ind d dic d ate a a at a sac sa lea ea e eanse s s s s p p par p p p p p p a ati a a a on n n n n n y diffu usin n ng n n iintoth o esu e e rro o o o oundiiing ass co oate ed te e des s s siiign i ,th , ttt , ee el e e ement l po o or o tio o o o o onof offff off tthe dev v v v vice e e e e an an and n a is only ldirre re re recttl tttt yab yab b b yab b y b y y b y o o ove the e e e e e area offailure. G Glass/C Ceramic c c c c Subs strate e e e e M M Multtiple Fuse Ele e emen n nts Su M Sin M M Multi-laye er Design F Figurre 1 Figu ure re e e e re 2 Fault Zone Multi-layer Design Single-la 2410 0 0 0 0 0SFV V VF V V V V V V uses r SMD D F Fus F F ewhich is very suitable t t ti li ti Figure 3 |
Similar Part No. - 0603SFS300F32 |
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Similar Description - 0603SFS300F32 |
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