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SC0805ML390K Datasheet(PDF) 5 Page - Socay Electornics Co., Ltd. |
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SC0805ML390K Datasheet(HTML) 5 Page - Socay Electornics Co., Ltd. |
5 / 8 page Surface Mount Multilayer Varistor Revision November 28, 2013 5 / 8 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SC0805ML - SC2220ML Series SOCAY Electronics Co., Ltd. www.socay.com Length (L) Width (W) Thickness (T) Size EIA (EIAJ) Inches Millimeters Inches Millimeters Inches Millimeters 0805 (2012) 0.079 ±0.008 2.00 ±0.20 0.049 ±0.006 1.25 ±0.15 0.047 Max 1.20 Max 1206 (3216) 0.126 ±0.008 3.20 ±0.20 0.063 ±0.006 1.60 ±0.15 0.059 Max 1.50 Max 1210 (3225) 0.126 ±0.008 3.20 ±0.20 0.098 ±0.008 2.50 ±0.20 0.059 Max 1.50 Max 1812 (4532) 0.177 ±0.008 4.50 ±0.20 0.126 ±0.008 3.20 ±0.20 0.079 Max 2.00 Max 2220 (5750) 0.224 ±0.008 5.70 ±0.20 0.197 ±0.008 5.00 ±0.20 0.098 Max 2.50 Max l Recommended solder Pad Layout A B C D Size EIA (EIAJ) Inches Millimeters Inches Millimeters Inches Millimeters Inches Millimeters 0805 (2012) 0.039~0.059 1.0~1.5 0.126~0.150 3.2~3.8 0.047~0.055 1.2~1.4 0.012~0.024 0.3~0.6 1206 (3216) 0.071~0.098 1.8~2.5 0.165~0.228 4.2~5.8 0.047~0.063 1.2~1.6 0.016~0.032 0.4~0.8 1210 (3225) 0.071~0.098 1.8~2.5 0.165~0.228 4.2~5.8 0.071~0.098 1.8~2.5 0.020~0.040 0.5~1.0 1812 (4532) 0.098~0.138 2.5~3.5 0.217~0.240 5.5~6.1 0.091~0.126 2.3~3.2 0.024~0.043 0.6~1.1 2220 (5750) 0.138~0.181 3.5~4.6 0.236~0.283 6.0~7.2 0.189~0.217 4.8~5.5 0.047~0.090 1.2~2.3 l The solder paste shall be printed in a thickness of 150 to 200 μm. l The SIR test of the solder paste shall be done (Base on JIS-Z-3284) l IR Soldering Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is not subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre-heating to within 100 degrees of the solder peak temperature is essential to minimize thermal shock. Dimensions L T W Soldering Recommendations Avoid material run this area |
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