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1410946-1 Datasheet(PDF) 13 Page - Tyco Electronics |
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1410946-1 Datasheet(HTML) 13 Page - Tyco Electronics |
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13 / 26 page  149 Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666 Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686 Specifications subject specified. Latin/S. Am.: +54 (0) 11-4733-2200 Netherlands: +31 (0) 73-6246-999 www.te.com to change. USA: +1 (800) 522-6752 Germany: +49 (0) 6251-133-1999 China: +86 (0) 400-820-6015 High Speed Backplane Connectors 5 MULTIGIG RT Tier 2 Connector System Target Applications I High speed telecommunica- tions equipment I Midrange and high-end servers I Networking equipment I Blindmate design I High speed custom platforms I Mass data storage I Rugged, mission-critical applications Product Features I Excellent performance to 6.25+ Gb/s– I High density: 113 contacts per inch provides 56 contact pairs per inch for differential signaling I Options include 20.32 [.800] and 25.40 [1.000] pitch card spacing I Modular options for signal, power, keying and guidance I Optimized footprints I Robust design I Low noise levels I Supports differential pair widths of 6 mils with 9 mil spacings I Single-ended, open pin field and power wafers available The MULTIGIG RT Tier 2 connector is the latest product release to meet customer requirements for high-density and high- performance two-piece interconnects. In TE and independent lab tests, the MULTIGIG RT Tier 2 connector has performed in excess of 6 Gb/s using standard FR-4 board mate- rial and routing techniques, and has been demon- strated to 10 Gb/s. The MULTIGIG RT Tier 2 connector system provides the flexibility to configure the daughtercard for Differential, Single-ended, Open Pin Field, or Power within a single connector module. All of these options then mate into a common Backplane Receptacle. The robust connector uses daughtercard plugs with a printed circuit board (PCB) wafer design and back- plane receptacles with a completely enclosed dual- beam design. All signal lines use redundant points of contact for high reliability. The MULTIGIG RT Tier 2 connector is available for both 20.32 [.800] and 25.40 [1.000] pitch card spacing. The totally modular system allows flexibility in choosing signal and power modules as well as guidance, keying, and electrostatic discharge (ESD) modules to meet the most demanding applica- tions. Signal modules can be customized for specific electrical requirements — such as sequencing — that are critical in high speed applications. Power modules are available with two- and four-voltage options, each circuit capa- ble of carrying 20 amps. The robust metal guide pin provides eight keying options and a unique ESD contact to discharge static when daughtercards are hot-plugged. Availability Fully validated SPICE models: E-mail requests to modeling@te.com Pro/E models and IGES models: E-mail requests to TECAD@te.com www.te.com IGES is a trademark of IAMBA Networks, Inc. PRO/E is a trademark of Parametric Technology Corp. |
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