LUXEON Flip Chip DS116 ©2013 Philips Lumileds Lighting Company.

Features

• High drive current up to

• 1.0 mm x 1.0 mm 5-sided emitter

• 440-460 nm wave length

• Low typical forward voltage of 2.9V

• Low thermal resistance

• Symmetric, large bond pads bumped

with AuSn solder

Key Applications

• High-power LED emitters

• Chip on board applications

• Remote phosphor applications

Benefits

• High current density for high

lumen and lm/$ at high lm/W

• High-packaging density

• 5-sided emitter for dispense and

remote phosphor applications

• Surface mount capable

• No wire bonds

• Robust design with proven

Lumileds reliability

LUXEON Flip Chip

Chip Scale Package LED

Introduction

Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level

and customize the phosphor and packaging to best suit their lighting applications.

LUXEON Flip Chip is a real Chip Scale Package LED that can be attached by reflow without additional packaging.

Traditional wire bonding limits the packing and power density of LEDs. LUXEON Flip Chip LEDs can be packaged

closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen

output at higher lumen densities.

This document contains the performance data needed to design and engineer Philips Lumileds LUXEON Flip Chip

based application.