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THS4509RGTT Datasheet(PDF) 31 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # THS4509RGTT
Description  WIDEBAND, LOW-NOISE, LOW-DISTORTION, FULLY-DIFFERENTIAL AMPLIFIER
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

THS4509RGTT Datasheet(HTML) 31 Page - National Semiconductor (TI)

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0.144
0.0195
0.144
0.010
vias
Pin 1
Top View
0.012
0.030
0.0705
0.015
0.0095
0.049
0.032
0.0245
THS4509
www.ti.com
SLOS454H – JANUARY 2005 – REVISED NOVEMBER 2009
PowerPAD PCB LAYOUT
useful for slowing the heat transfer during
CONSIDERATIONS
soldering operations. This resistance makes the
soldering of vias that have plane connections
Although there are many ways to properly heatsink
easier. In this application, however, low thermal
the PowerPAD package, the following steps illustrate
resistance is desired for the most efficient heat
the recommended approach.
transfer. Therefore, the holes under the IC
PowerPAD package should make the connection
to the internal ground plane, with a complete
connection around the entire circumference of the
plated-through hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This configuration prevents
solder from being pulled away from the thermal
pad area during the reflow process.
7. Apply solder paste to the exposed thermal pad
area and all of the IC terminals.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder
reflow
operation
as
any
standard
surface-mount component. This process results
in a part that is properly installed.
The next consideration is the package constraints.
Figure 93. PowerPAD PCB Etch and Via Pattern
The two sources of heat within an amplifier are
quiescent power and output power. The designer
1. Prepare the PCB with a top side etch pattern as
should
never
forget
about
the
quiescent
heat
shown in Figure 93. There should be etch for the
generated within the device, especially multi-amplifier
leads as well as etch for the thermal pad.
devices. Because these devices have linear output
2. Place five holes in the area of the thermal pad.
stages (Class AB), most of the heat dissipation is at
The holes should be 13 mils (0.013 in, 0,33 mm)
low output voltages with high output currents.
in diameter. Keep them small so that solder
The other key factor when dealing with power
wicking through the holes is not a problem during
dissipation is how the devices are mounted on the
reflow.
PCB. The PowerPAD devices are extremely useful
3. Additional vias may be placed anywhere along
for heat dissipation. But the device should always be
the thermal plane outside of the thermal pad
soldered to a copper plane to fully use the heat
area. They help dissipate the heat generated by
dissipation properties of the PowerPAD. The SOIC
the IC. These additional vias may be larger than
package, on the other hand, is highly dependent on
the 13-mil diameter vias directly under the
how it is mounted on the PCB. As more trace and
thermal pad. They can be larger because they
copper area is placed around the device,
θJA
are not in the thermal pad area to be soldered, so
decreases
and
the
heat
dissipation
capability
that wicking is not a problem.
increases. For a single package, the sum of the RMS
4. Connect all holes to the internal ground plane.
output currents and voltages should be used to
choose the proper package.
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
connection methodology. Web connections have
a high thermal resistance connection that is
Copyright © 2005–2009, Texas Instruments Incorporated
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Product Folder Link(s): THS4509


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