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LDECD3470JA5N00 Datasheet(PDF) 14 Page - Kemet Corporation |
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LDECD3470JA5N00 Datasheet(HTML) 14 Page - Kemet Corporation |
14 / 16 page 14 SMD Film Capacitors 07/2008 Preheating Maximum preheating time: 180 s Minimum temperature: 150 °C Maximum temperature: 200 °C Maximum temperature on the component’s body (Tmax): Maximum time within Tmax and Tmax - 5 °C (∆T5): 30 s (Tmax ≤ 250 °C) 10 s (250 °C < Tmax ≤ 255 °C *) Maximum time over 217 °C (∆T217): 150 s Maximum temperature ramp rate: 3 °C / s (heating) 6 °C / s (cooling) Second reflow if two reflow processes are needed, be sure that, before the second reflow, the temperature on the capacitor’s surface is lower than 50 °C. * For LDB series this value is 260 °C. Landing areas and solder paste suggestions Size ** A [mm] B [mm] C [mm] D [mm] 12.06 1.5 1.1 2.3 4.5 12.10 2.3 1.1 2.3 4.5 18.12 3.0 1.7 3.1 6.5 22.20 4.6 2.1 3.9 8.1 28.24 5.7 2.3 5.3 9.9 40.30 7.4 2.6 8.2 13.4 50.40 9.6 2.6 10.7 15.9 60.54 12.6 2.6 13.2 18.4 These new landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design. The preceding layout (2004 Catalogue) is therefore to be considered still valid, although not optimal for RoHS 6. Soldering recommendations and cautions Capacitor Hmax [mm] Capacitor volume [mm3] < 350 350 - 2000 > 2000 < 1.6 255 °C * 255 °C * 255 °C * 1.6 - 2.5 255 °C * 250 °C 245 °C > 2.5 250 °C 245 °C 245 °C in line with JEDEC STD 020D ed. June 2007 with some limitations Reflow recommendations Reflow temperature profile We suggest to use a Sn / Ag / Cu solder paste (suggested thickness: 0.10 ÷ 0.15 mm). If a NOT Lead Free solder paste is used, a minimum peak temperature of 210 °C on the component’s body is suggested. Linear profiles are also allowed (if in line with the reflow recommendations) ** For customized sizes, specific landing areas suggestions are available |
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