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CP763V Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CP763V Datasheet(HTML) 1 Page - Central Semiconductor Corp |
1 / 2 page GEOMETRY PRINCIPAL DEVICE TYPE CZT955 GROSS DIE PER 5 INCH WAFER 7,140 PROCESS CP763V Power Transistor PNP - High Current Transistor Chip PROCESS DETAILS Die Size 48.8 x 48.8 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 7.9 x 7.9 MILS Emitter Bonding Pad Area 9.1 x 18.1 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Ti/Ni/Ag - 2,000Å/3,000Å/20,000Å www.centr a lsemi.com R0 (2-August 2012) |
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