4/20

29.Nov.2013 Rev.003

www.rohm.com

© 2013 ROHM Co., Ltd. All rights reserved.

TSZ22111・15・001

BD4275FP2-C

BD4275FPJ-C

Datasheet

TSZ02201-0T2T0AN00110-1-2

Absolute Maximum Ratings

Parameter

Symbol

Limits

Unit

VCC Voltage

(1)

-0.3 to +45.0

V

RO Voltage

-0.3 to +18.0

V

VO Voltage

-0.3 to +7.0

V

Power Dissipation

(TO263-5F)

(2)

Pd

1.9

W

(TO252-J5F)

(3)

Pd

1.3

W

Junction Temperature Range

Tj

-40 to +150

°C

Storage Temperature Range

Tstg

-55 to +150

°C

(1)

Not to exceed Pd.

(2)

Reduced by 15.2 mW / °C over Ta = 25 °C, when mounted on glass epoxy board: 114.3 mm × 76.2 mm × 1.6 mm.

(3)

Reduced by 10.4 mW / °C over Ta = 25 °C, when mounted on glass epoxy board: 114.3 mm × 76.2 mm × 1.6 mm.

Recommended Operating Ratings

Parameter

Symbol

Min

Max

Unit

Supply Voltage

(1)

5.5

45.0

V

Supply Voltage

(1)

5.9

45.0

V

Start -Up Voltage

3.0

－

V

Output Current

0

500

mA

Operating Ratings Temperature

Ta

-40

125

°C

(1)

Not to exceed Pd.

Thermal Resistance

Parameter

Symbol

Min

Max

Unit

TO263-5F Package

Junction to Ambient

(1)

θja

15.6

－

°C / W

Junction to Case (bottom)

(1)

θjc

1

－

°C / W

TO252-J5F Package

Junction to Ambient

(2)

θja

19.2

－

°C / W

Junction to Case (bottom)

(2)

θjc

1

－

°C / W

(1)

TO263-5F mounted on 114.3 mm

(4-layer PCB: Copper foil on 2 inner layers and the reverse side of PCB:74.2 mm

(2)

TO252-J5F mounted on 114.3 mm

(4-layer PCB: Copper foil on 2 inner layers and the reverse side of PCB:74.2 mm