R08DS0012EJ0100 Rev.1.00

Page 11 of 14

Mar 19, 2012

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature

260

°C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220

°C

60 seconds or less

• Time to preheat temperature from 120 to 180

°C 120 ± 30 s

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

120±30 s

(preheating)

220

°C

180

°C

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260

°C MAX.

120

°C

(2) Wave soldering

• Temperature

260

°C or below (molten solder temperature)

• Time

10 seconds or less

• Preheating conditions

120

°C or below (package surface temperature)

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content

of 0.2 Wt% is recommended.)

(3) Soldering by soldering iron

• Peak temperature (lead part temperature)

350

°C or below

• Time (each pins)

3 seconds or less

• Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.

(4) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

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