PS2561F-1,PS2561FL-1

Chapter Title

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Jan 06, 2012

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

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C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220°C

60 seconds or less

• Time to preheat temperature from 120 to 180°C

120±30 s

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with a maximum chlorine content of 0.2 Wt% is

recommended.)

120±30 s

(preheating)

220°C

180°C

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260°C MAX.

120°C

(2) Wave soldering

• Temperature

260°C or below (molten solder temperature)

• Time

10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

• Peak Temperature (lead part temperature) 350°C or below

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maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(4) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

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