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LTST-S271KRWT Datasheet(PDF) 9 Page - Lite-On Technology Corporation

Part No. LTST-S271KRWT
Description  ROHS, Side Looking Chip LED, Ultra Bright A1InGaP Chip LED
Download  12 Pages
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Maker  LITEON [Lite-On Technology Corporation]
Homepage  http://www.liteon.com.tw/databook/default.htm

LTST-S271KRWT Datasheet(HTML) 9 Page - Lite-On Technology Corporation

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P r o p e r t y o f L i t e - O n O n l y
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1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within
one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed
container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than one week should be baked at about 60 deg C for at least
20 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering
Soldering iron
Pre-heat time
Peak temperature
Soldering time
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Soldering notes:
Because different board designs use different number and types of devices, solder pastes, reflow ovens,
and circuit boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and
PCB-specific characterization.
LITE-ON Runs both component-level verification using in-house
KYRAMX98 reflow chambers and
board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully
and reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and recommendations from the
solder paste manufacturer to avoid damaging the device and create a reliable solder joint.

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