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OPA603AP Datasheet(PDF) 4 Page - Burr-Brown (TI) |
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OPA603AP Datasheet(HTML) 4 Page - Burr-Brown (TI) |
4 / 12 page ® OPA603 4 Top View DIP PIN CONFIGURATION Top View SO-16 1 2 3 4 5 6 7 8 NC NC –In NC +In NC –V S NC NC: No Internal Connection. Solder to ground plane for improved heat dissipation. 16 15 14 13 12 11 10 9 NC NC +V S NC V O NC NC NC PIN CONFIGURATION 1 2 3 4 8 7 6 5 NC –In +In –V NC +V V NC S S NC: No Internal Connection. Solder to ground plane for improved heat dissipation. O PACKAGE/ORDERING INFORMATION PACKAGE SPECIFIED DRAWING TEMPERATURE PRODUCT PACKAGE NUMBER(1) RANGE OPA603AP Plastic DIP 006 –25 °C to +85°C OPA603AU SO-16 211 –25 °C to +85°C NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ABSOLUTE MAXIMUM RATINGS Supply Voltage ................................................................................... ±18V Input Voltage Range ............................................................................ ±V S Differential Input Voltage ..................................................................... ±6V Power Dissipation ........................................................ See derating curve Operating Temperature ................................................................. +100 °C Storage Temperature ..................................................................... +150 °C Junction Temperature .................................................................... +150 °C Lead Temperature (soldering, 10s) ............................................... +300 °C (soldering SO-16 package, 3s) ...................... +260 °C ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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