®

OPA603

4

Top View

DIP

PIN CONFIGURATION

Top View

SO-16

1

2

3

4

5

6

7

8

NC

NC

–In

NC

+In

NC

–V

S

NC

NC: No Internal Connection.

Solder to ground plane for

improved heat dissipation.

16

15

14

13

12

11

10

9

NC

NC

+V

S

NC

V

O

NC

NC

NC

PIN CONFIGURATION

1

2

3

4

8

7

6

5

NC

–In

+In

–V

NC

+V

V

NC

S

S

NC: No Internal Connection.

Solder to ground plane for

improved heat dissipation.

O

PACKAGE/ORDERING INFORMATION

PACKAGE

SPECIFIED

DRAWING

TEMPERATURE

PRODUCT

PACKAGE

RANGE

OPA603AP

Plastic DIP

006

–25

°C to +85°C

OPA603AU

SO-16

211

–25

°C to +85°C

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

ABSOLUTE MAXIMUM RATINGS

Supply Voltage ...................................................................................

±18V

Input Voltage Range ............................................................................

±V

S

Differential Input Voltage .....................................................................

±6V

Power Dissipation ........................................................ See derating curve

Operating Temperature ................................................................. +100

°C

Storage Temperature ..................................................................... +150

°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

(soldering SO-16 package, 3s) ...................... +260

°C

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes

could cause the device not to meet its published specifications.