3

®

OPA1013

1

2

3

4

8

7

6

5

–

Out A

–In A

+In A

V–

V+

Out B

–In B

+In B

–

A

B

DICE INFORMATION

CONNECTION DIAGRAM

N8 — Plastic Package — Top View

PAD

FUNCTION

1

Output A

2

–In A

3

+In A

4V–

5

+In B

6

–In B

7

Output B

8V+

OPA1013 DIE TOPOGRAPHY

4

MECHANICAL INFORMATION

MILS (0.001")

MILLIMETERS

Die Size

112 x 100

±5

2.84 x 2.54

±0.13

Die Thickness

20

±3

0.51

±0.08

Min. Pad Size

4 x 4

0.10 x 0.10

Transistor Count

92

Backing

Gold

ABSOLUTE MAXIMUM RATINGS

Power Supply Voltage .......................................................................

±22V

Differential Input Voltage ...................................................................

±30V

Input Voltage ...................................................................... V+ to (V–) –5V

Operating Temperature: ....................................................... 0

°C to +70°C

Storage Temperature .......................................................... –65 to +150

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

PACKAGE INFORMATION

PACKAGE DRAWING

MODEL

PACKAGE

OPA1013CN8

Plastic DIP

006

OPA1013DN8

Plastic DIP

006

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix D of Burr-Brown IC Data Book.

ORDERING INFORMATION

MODEL

PACKAGE

TEMPERATURE RANGE

OPA1013CN8

Plastic DIP

0

°C to +70°C

OPA1013DN8

Plastic DIP

0

°C to +70°C

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.