PBSS4032SN

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Product data sheet

Rev. 2 — 13 October 2010

3 of 15

NXP Semiconductors

PBSS4032SN

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

Per device

total power dissipation

[1] -0.86

W

[2] -1.4

W

[3] -2.3

W

junction temperature

-

150

°C

ambient temperature

−55

+150

°C

storage temperature

−65

+150

°C

(3) FR4 PCB, standard footprint

Fig 1.

Per device: Power derating curves

Table 6.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

−75

175

125

25

75

−25

006aac278

1.0

2.0

3.0

(W)

0.0

(1)

(3)

(2)