 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
OPA347NA250G4 Datasheet(PDF) 11 Page - Texas Instruments |
|
||||||||||||||||||||||||||||||
OPA347NA250G4 Datasheet(HTML) 11 Page - Texas Instruments |
|
|
11 / 33 page  OPA347, 2347, 4347 11 SBOS167D www.ti.com OPA2347 WCSP PACKAGE The OPA2347YED and OPA2347YZDR are die-level pack- ages using bump-on-pad technology. The OPA2347YED de- vice has tin-lead balls; the OPA2347YZDR has lead-free balls. Unlike devices that are in plastic packages, these devices have no molding compound, lead frame, wire bonds, or leads. Using standard surface-mount assembly procedures, the WCSP can be mounted to a printed circuit board without additional under fill. Figures 10 and 11 detail pinout and package marking. FIGURE 10. Pin Description. FIGURE 11. Top View Package Marking. 1 2 3 4 8 7 6 5 V+ Out B –In B +In B Out A –In A +In A V– OPA2347 (bump side down) Not to Scale WCSP-8 (top view) TEST CONDITION ACCEPT CRITERIA (ACTUAL) SAMPLE SIZE Temperature Cycle –40 °C to 125°C, 1 Cycle/hr, 15 Minute Ramp(1) 10 Minute Dwell 500 (1600) Cycles, R < 1.2X from R0 36 Drop 50cm 10 (129) Drops, R < 1.2X from R0 8 Key Push 100 Cycles/min, 5K (6.23K) Cycles, R < 1.2X from R0 8 1300 µε, Displacement = 2.7mm Max 3 Point Bend Strain Rate 5 mm/min, 85 mm Span R < 1.2X from R0 8 NOTE: (1) Per IPC9701. TABLE I. Reliability Test Results. OPA2347YED Top View (bump side down) Actual Size: Package Marking Code: YMD = year/month/day CC = indicates OPA2347YED A9 = indicates OPA2347YZD S = for engineering purposes only Exact Size: 1.008mm x 2.100mm PHOTOSENSITIVITY Although the OPA2347YED/YZD package has a protective backside coating that reduces the amount of light exposure on the die, unless fully shielded, ambient light will still reach the active region of the device. Input bias current for the OPA2347YED/YZD package is specified in the absence of light. Depending on the amount of light exposure in a given application, an increase in bias current, and possible in- creases in offset voltage should be expected. In circuit board tests under ambient light conditions, a typical increase in bias current reached 100pA. Flourescent lighting may introduce noise or hum due to their time varying light output. Best practice should include end-product packaging that provides shielding from possible light souces during operation. RELIABILITY TESTING To ensure reliability, the OPA2347YED and OPA2347YZDR devices have been verified to successfully pass a series of reliability stress tests. A summary of JEDEC standard reli- ability tests is shown in Table I. |
Similar Part No. - OPA347NA250G4 |
|
Similar Description - OPA347NA250G4 |
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
