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TS68302DESC01QXC Datasheet(PDF) 9 Page - ATMEL Corporation |
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TS68302DESC01QXC Datasheet(HTML) 9 Page - ATMEL Corporation |
9 / 47 page 9 TS68302 2117A–HIREL–11/02 The total thermal resistance of a package ( θ JA) can be separated into two components, θ JC and θCA, representing the barrier to heat flow from the semiconductor junction to the package (case), surface ( θ JC) and from the case to the outside ambient (θCA). These terms are related by the equation: θ JA = θJC + θCA (4) θ JC is device-related and cannot be influenced by the user. However, θCA is user-depen- dent and can be minimized by such thermal management techniques as heat sinks, ambient air cooling and thermal convection. Thus, good thermal management on the part of the user can significantly reduce θ CA so that θJA approximately equals θJC. Substi- tution of θ JC for θJA in equation (1) will result in a lower semiconductor junction temperature. Mechanical and Environment The microcircuits shall meet all mechanical environmental requirements of either MIL- STD-883 for class B devices or Atmel standards. Marking The document that defines the marking is identified in the related reference documents. Each microcircuit is legible and permanently marked with the following information as minimum: • Atmel Logo • Manufacturer’s part number • Class B identification • Date-code of inspection lot • ESD identifier if available • Country of manufacturing Quality Conformance Inspection DESC/MIL-STD-883 Those quality levels are in accordance with MIL-M-38535 and method 5005 of MIL- STD-883. Groups A and B inspections are performed on each production lot. Groups C and D inspection are performed on a periodical basis. Electrical Characteristics General Requirements All static and dynamic electrical characteristics specified. For inspection purposes, refer to relevant specification: • DESC see “DESC/MIL-STD-883” on page 9 Table 5 and Table 6: Static Electrical Characteristics for all electrical variants. Test methods refer to IEC 748-2 method number, where existing. Table 7 and Table 8: Dynamic Electrical Characteristics. Test methods refer to this specification. |
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