External Visual

No abnormal exterior appearance

Microscope (´10)

Physical Dimensions

Within the specified dimensions

Using The calipers

Mechanical Shock

Three shocks in each direction should be applied along

Capacitance Change : Within ±10%

3 mutually perpendicular axes of the test specimen (18 shocks)

Tan δ, IR : initial spec.

Vibration

5g's for 20min., 12cycles each of 3 orientations,

Capacitance Change : Within ±10%

Use 8"×5" PCB 0.031" Thick 7 secure points on one long side

Tan δ, IR : initial spec.

and 2 secure points at corners of opposite sides. Parts mounted

within 2" from any secure point. Test from 10~2000㎐.

Resistance to

Solder pot : 260±5℃, 10±1sec.

Solder Heat

Capacitance Change : Within ±10%

Tan δ, IR : initial spec.

Thermal Shock

-55℃/+125℃.

Capacitance Change : Within ±10%

Note: Number of cycles required-300,

Tan δ, IR : initial spec.

Maximum transfer time-20 sec, Dwell time-15min. Air-Air

ESD

AEC-Q200-002

Capacitance Change : Within ±10%

Tan δ, IR : initial spec.

Solderability

95% of the terminations is to be soldered

a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃

ldti

l

b) St

i

f

8 h

I

i

ld

f

5

t 245 5℃

Velocity

Performance

Test condition

Duration

Wave

Appearance : No abnormal exterior appearance

Appearance : No abnormal exterior appearance

Appearance : No abnormal exterior appearance

1,500G

Peakvalue

Appearance : No abnormal exterior appearance

0.5ms

Half sine

4.7m/sec.

Appearance : No abnormal exterior appearance

evenly and continuously

b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃

c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃

solder : a solution ethanol and rosin

Electrical

Capacitance : Within specified tolerance

The Capacitance /D.F. should be measured at 25℃,

Characterization

Tan δ (DF) : 0.025 max.

1㎑±10%, 1.0±0.2Vrms

IR(25℃) : More than 10,000㏁ or 500㏁×㎌

I.R. should be measured with a DC voltage not exceeding

IR(125℃) : More than1,000㏁ or 10㏁×㎌

Rated Voltage @25℃, @125℃ for 60~120 sec.

Whichever is Smaller

Dielectric Strength

Dielectric Strength : 250% of the rated voltage for 1~5 seconds

Board Flex

Bending to the limit (2㎜) for 5 seconds

Capacitance Change : Within ±10%

Terminal

18N, for 60±1 sec.

Strength(SMD)

Capacitance Change : Within ±10%

Beam Load

Destruction value should not be exceed

Beam speed

Chip Length ≥ 3.2㎜

2.5±0.25㎜/sec

a) Chip Thickness < 1.25㎜ : 15N

b) Chip Thickness ≥ 1.25㎜ : 54.5N

Temperature

X7R

Characteristics

(From -55℃ to 125℃, Capacitance change should be within ±15%)

C. Recommended Soldering method :

Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )

Meet IPC/JEDEC J-STD-020 D Standard

* For the more detail Specification, Please refer to the Samsung MLCC catalogue.

Appearance : No abnormal exterior appearance

Appearance : No abnormal exterior appearance