Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.COM

X  

CIM03J121 Datasheet(PDF) 1 Page - Samsung semiconductor

Part # CIM03J121
Description  Chip Bead CIB/CIM Series
Download  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

CIM03J121 Datasheet(HTML) 1 Page - Samsung semiconductor

  CIM03J121 Datasheet HTML 1Page - Samsung semiconductor CIM03J121 Datasheet HTML 2Page - Samsung semiconductor CIM03J121 Datasheet HTML 3Page - Samsung semiconductor CIM03J121 Datasheet HTML 4Page - Samsung semiconductor CIM03J121 Datasheet HTML 5Page - Samsung semiconductor CIM03J121 Datasheet HTML 6Page - Samsung semiconductor CIM03J121 Datasheet HTML 7Page - Samsung semiconductor CIM03J121 Datasheet HTML 8Page - Samsung semiconductor CIM03J121 Datasheet HTML 9Page - Samsung semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 1 / 16 page
background image
CIB Series
The CIB Series is composed of mono-layer internal conductor that allows low impedance and low DC resistance.
CIM Series
The CIM Series display high impedance because it is composed of a multilayered internal conductor and has excellent
attenuation characteristics for wide band frequencies.
(1) Chip Beads
(2) B:Mono-layer type, M:Multi-layer type
(3) Dimension
(4) Material Code
P,U:Broad impedance, especially suppresses noise in the 10~200MHz range
J :Suppresses noise in the 100~300MHz range
K :Suppresses noise in the 200MHz above
N :Suppresses noise in the 200~500MHz range
(5) Nominal impedance (110:11
Ω ; 121:120Ω)
(6) Thickness option(N:Standard , A:Thinner than standard , B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
Ferrite Body
External Electrode
CI
M
03
J
121
N
C
L
W
t
d
L
SIZE CODE
W
t
d
0.6
±0.03
1.0
±0.05
1.6
±0.15
2.0
±0.2
3.2
±0.2
3.2
±0.2
4.5
±0.2
4.5
±0.2
Operating Temp
Storage Temp
-55~+125
-10~+40
0.15
±0.05
0.25
±0.1
0.3
±0.2
0.5
+0.2,-0.3
0.5
+0.2,-0.3
0.5
±0.3
0.5
±0.3
0.5
±0.3
03
05
10
21
31
32
41
43
The CIB/CIM Series are used for EMI suppression filter. These beads suppress electro-magnetic wave noise by
increased impedance, especially by increased resistance at noise frequency.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Unit: mm
Part Numbering
•Smallest beads suitable for surface mounting
•Perfect shape for automatic mounting, with no directionality.
•Excellent solderability and high heat resistance for either flow or
reflow soldering.
•Monolithic inorganic material construction for high reliability.
•Closed magnetic circuit configuration avoids crosstalk and is suitable
for high density PCBs.
Feature
•High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
Application
Dimensions
0.3
±0.03
0.5
±0.05
0.8
±0.15
1.25
±0.2
1.6
±0.2
2.5
±0.2
1.6
±0.2
3.2
±0.2
0.3
±0.03
0.5
±0.05
0.8
±0.15
0.9
±0.2
1.1
±0.2
1.3
±0.2
1.6
±0.2 / 1.2±0.2
1.5
±0.2
Chip Bead ; CIB/CIM Series
For EMI Suppression


Similar Part No. - CIM03J121

ManufacturerPart #DatasheetDescription
logo
Samsung semiconductor
CIM03J121 SAMSUNG-CIM03J121 Datasheet
1Mb / 16P
   Chip Bead ; CIB/CIM Series For EMI Suppression
CIM03J121 SAMSUNG-CIM03J121 Datasheet
1Mb / 16P
   Chip Bead CIB/CIM Series For EMI Suppression
CIM03J121 SAMSUNG-CIM03J121 Datasheet
1Mb / 16P
   Chip Bead CIB/CIM Series For EMI Suppression
CIM03J121 SAMSUNG-CIM03J121 Datasheet
4Mb / 31P
   MULTILAYER CHIP COMPONENTS
CIM03J121 SAMSUNG-CIM03J121 Datasheet
1Mb / 16P
   Chip Bead CIB/CIM Series For EMI Suppression
More results

Similar Description - CIM03J121

ManufacturerPart #DatasheetDescription
logo
Samsung semiconductor
CIM21J601NE SAMSUNG-CIM21J601NE Datasheet
1Mb / 16P
   Chip Bead ; CIB/CIM Series
CIB21P260NE SAMSUNG-CIB21P260NE Datasheet
1Mb / 16P
   Chip Bead CIB/CIM Series For EMI Suppression
CIM31U601NE SAMSUNG-CIM31U601NE Datasheet
1Mb / 16P
   Chip Bead ; CIB/CIM Series For EMI Suppression
CIB32P600NE SAMSUNG-CIB32P600NE Datasheet
1Mb / 16P
   Chip Bead CIB/CIM Series For EMI Suppression
CIM10J301NC SAMSUNG-CIM10J301NC Datasheet
1Mb / 16P
   Chip Bead CIB/CIM Series For EMI Suppression
logo
Powerex Power Semicondu...
CP10TD1-24A POWEREX-CP10TD1-24A Datasheet
336Kb / 6P
   DIP-CIB
logo
Bourns Electronic Solut...
MH2029_MDS BOURNS-MH2029_MDS Datasheet
232Kb / 1P
   Ferrite Chip Bead Series
MH4516_MDS BOURNS-MH4516_MDS Datasheet
214Kb / 1P
   Ferrite Chip Bead Series
MH1608_MDS BOURNS-MH1608_MDS Datasheet
214Kb / 1P
   Ferrite Chip Bead Series
MH3261_MDS BOURNS-MH3261_MDS Datasheet
217Kb / 1P
   Ferrite Chip Bead Series
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com