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CIH05T1N5S Datasheet(PDF) 2 Page - Samsung semiconductor |
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CIH05T1N5S Datasheet(HTML) 2 Page - Samsung semiconductor |
2 / 3 page Ver 201207 Part No. Inductance (nH) @100MHz Q (min) 100MHz Q(typical.) SRF (MHz) Min DC resistance (Ω) Max. Rated current (mA) Max. 500 MHz 800 MHz 1.8GHz 2.0GHz 2.4GHz CIH05T12N□ 12.0±5%, 10% 8 22 28 33 31 23 2700 0.50 300 CIH05T15N□ 15.0±5%, 10% 8 22 28 29 26 17 2300 0.55 300 CIH05T18N□ 18.0±5%, 10% 8 23 28 26 22 11 2100 0.65 250 CIH05T22N□ 22.0±5%, 10% 8 22 27 21 14 2 1900 0.80 250 CIH05T27N□ 27.0±5%, 10% 8 20 23 10 3 - 1600 0.90 250 CIH05T33N□ 33.0±5%, 10% 8 20 23 3 - - 1300 1.00 250 CIH05T39N□ 39.0±5%, 10% 8 20 21 - - - 1200 1.20 200 CIH05T47N□ 47.0±5%, 10% 8 19 20 - - - 1000 1.30 200 CIH05T56N□ 56.0±5%, 10% 8 19 18 - - - 750 1.40 180 CIH05T68N□ 68.0±5%, 10% 8 17 15 - - - 750 1.40 180 CIH05T82N□ 82.0±5%, 10% 8 16 11 - - - 600 1.60 150 CIH05TR10□ 100.0±5%, 10% 8 15 9 - - - 600 1.60 130 *Operating temperature range –55 to +125°C CI H05T10NJNC (1) (2) (3) (4) (5) (6) (7) (8) (1) Chip Inductor (2) H:High frequency type (3) Dimension (4) Material code(T:Dielectric material) (5) Inductance(4N7:4.7nH, 10N:10nH, R10:100nH) (6) Tolerance(C:±0.2nH, S:±0.3nH, J:±5%, K:±10%) (7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (8) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PRODUCT IDENTIFICATION ※Tolerance (C :±0.2nH, S:±0.3nH, J :±5%, K :±10%) ※Measurement equipment & Jig: Agilent E4991A+16192A or Equivalent ※ The Rated Current is either the DC value at witch the internal Ls value is decreased within 5% with the application of DC_Current, or the value of current at which the temperature of the element is increased within 20℃ (Reference ambient temperature:20℃) |
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