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CIM03N800 Datasheet(PDF) 1 Page - Samsung semiconductor

Part # CIM03N800
Description  Chip Bead CIB/CIM Series For EMI Suppression
Download  16 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

CIM03N800 Datasheet(HTML) 1 Page - Samsung semiconductor

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CIB Series
The CIB Series is composed of mono-layer internal conductor that allows low impedance and low DC resistance.
CIM Series
The CIM Series display high impedance because it is composed of a multilayered internal conductor and has excellent
attenuation characteristics for wide band frequencies.
(1) Chip Beads
(2) B:Mono-layer type, M:Multi-layer type
(3) Dimension
(4) Material Code
P,U:Broad impedance, especially suppresses noise in the 10~200MHz range
J :Suppresses noise in the 100~300MHz range
K :Suppresses noise in the 200MHz above
N :Suppresses noise in the 200~500MHz range
(5) Nominal impedance (110:11
Ω ; 121:120Ω)
(6) Thickness option(N:Standard , A:Thinner than standard , B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
Ferrite Body
External Electrode
CI
M
03
J
121
N
C
L
W
t
d
L
SIZE CODE
W
t
d
0.6
±0.03
1.0
±0.05
1.6
±0.15
2.0
±0.2
3.2
±0.2
3.2
±0.2
4.5
±0.2
4.5
±0.2
Operating Temp
Storage Temp
-55~+125
-10~+40
0.15
±0.05
0.25
±0.1
0.3
±0.2
0.5
+0.2,-0.3
0.5
+0.2,-0.3
0.5
±0.3
0.5
±0.3
0.5
±0.3
03
05
10
21
31
32
41
43
The CIB/CIM Series are used for EMI suppression filter. These beads suppress electro-magnetic wave noise by
increased impedance, especially by increased resistance at noise frequency.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Unit: mm
Part Numbering
•Smallest beads suitable for surface mounting
•Perfect shape for automatic mounting, with no directionality.
•Excellent solderability and high heat resistance for either flow or
reflow soldering.
•Monolithic inorganic material construction for high reliability.
•Closed magnetic circuit configuration avoids crosstalk and is suitable
for high density PCBs.
Feature
•High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
Application
Dimensions
0.3
±0.03
0.5
±0.05
0.8
±0.15
1.25
±0.2
1.6
±0.2
2.5
±0.2
1.6
±0.2
3.2
±0.2
0.3
±0.03
0.5
±0.05
0.8
±0.15
0.9
±0.2
1.1
±0.2
1.3
±0.2
1.6
±0.2 / 1.2±0.2
1.5
±0.2
Chip Bead ; CIB/CIM Series
For EMI Suppression


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