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FXLP4555MPX Datasheet(PDF) 12 Page - Fairchild Semiconductor |
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FXLP4555MPX Datasheet(HTML) 12 Page - Fairchild Semiconductor |
12 / 13 page © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FXLP4555 • Rev. 1.0.0 12 Physical Dimensions Figure 13. 16-Lead, Molded Leadless Package (MLP), QUAD, JEDEC MO-220, 3mm Square Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/MLP16B.html. For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packaging/3x3MLP16_Pack_TNR.pdf. |
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