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TPPM0302DGNRG4 Datasheet(PDF) 8 Page - Texas Instruments |
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TPPM0302DGNRG4 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 16 page TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 THERMAL INFORMATION To ensure reliable operation of the device, the junction temperature of the output device must be within the safe operating area (SOA). This is achieved by having a means to dissipate the heat generated from the junction of the output structure. There are two components that contribute to thermal resistance. They consist of two paths in series. The first is the junction to case thermal resistance, RθJC; the second is the case to ambient thermal resistance, RθCA. The overall junction to ambient thermal resistance, RθJA, is determined by: RθJA = RθJC + RθCA The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout incorporated in the application. The operating junction temperature is determined by the operating ambient temperature, TA, and the junction power dissipation, PJ. The junction temperature, TJ, is equal to the following thermal equation: TJ = TA + PJ (RθJC) + PJ (RθCA) TJ = TA + PJ (RθJA) This particular application uses the 8-pin DGN PowerPAD package with a standard lead frame with dedicated ground terminal. Using a multilayer printed-circuit board (PCB), the power pad is mounted as recommended in the TI packaging application. The power pad is electrically connected to the ground plane of the circuit board through the dedicated ground pin and the die mount power pad. This will provide a means for heat spreading through the copper plane associated within the PCB (GND Layer). This concept could provide a thermal resistance from junction to ambient, RθJA, of 59°C/W if implemented correctly. Hence, maximum power dissipation allowable for an operating ambient temperature of 70 °C, and a maximum junction temperature of 150 °C is determined as: PJ = (TJ – TA) / RθJA PJ = (150 – 70) /59 = 1.36 W Using a multilayer board and utilizing the ground plane for heat spreading. 2.6 150 1.36 Power Dissipation Derate Curve Using High-K PCB Ambient Temperature – °C 25 70 NOTE: This curve is to be used for guideline purposes only. For a particular application, a more specific thermal characterization is required. Figure 12. Power Dissipation Derating Curve |
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