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TPPM0302DGNRG4 Datasheet(PDF) 8 Page - Texas Instruments

Part # TPPM0302DGNRG4
Description  400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
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TPPM0302DGNRG4 Datasheet(HTML) 8 Page - Texas Instruments

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TPPM0302
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT AND POK
SLVS316 – NOVEMBER 2000
8
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
To ensure reliable operation of the device, the junction temperature of the output device must be within the safe
operating area (SOA). This is achieved by having a means to dissipate the heat generated from the junction
of the output structure. There are two components that contribute to thermal resistance. They consist of two
paths in series. The first is the junction to case thermal resistance, RθJC; the second is the case to ambient
thermal resistance, RθCA. The overall junction to ambient thermal resistance, RθJA, is determined by:
RθJA = RθJC + RθCA
The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout
incorporated in the application. The operating junction temperature is determined by the operating ambient
temperature, TA, and the junction power dissipation, PJ.
The junction temperature, TJ, is equal to the following thermal equation:
TJ = TA + PJ (RθJC) + PJ (RθCA)
TJ = TA + PJ (RθJA)
This particular application uses the 8-pin DGN PowerPAD package with a standard lead frame with dedicated
ground terminal. Using a multilayer printed-circuit board (PCB), the power pad is mounted as recommended
in the TI packaging application. The power pad is electrically connected to the ground plane of the circuit board
through the dedicated ground pin and the die mount power pad. This will provide a means for heat spreading
through the copper plane associated within the PCB (GND Layer). This concept could provide a thermal
resistance from junction to ambient, RθJA, of 59°C/W if implemented correctly.
Hence, maximum power dissipation allowable for an operating ambient temperature of 70
°C, and a maximum
junction temperature of 150
°C is determined as:
PJ = (TJ – TA) / RθJA
PJ = (150 – 70) /59 = 1.36 W
Using a multilayer board and utilizing the ground plane for heat spreading.
2.6
150
1.36
Power Dissipation Derate Curve Using
High-K PCB
Ambient Temperature –
°C
25
70
NOTE: This curve is to be used for guideline purposes only. For a particular application, a more specific thermal characterization is required.
Figure 12. Power Dissipation Derating Curve


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