NCV8405, NCV8405A

http://onsemi.com

11

PACKAGE DIMENSIONS

SOT−223 (TO−261)

CASE 318E−04

ISSUE N

A1

b1

D

E

b

e

e1

4

12

3

0.08 (0003)

A

L1

C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCH.

1.5

0.059

mm

inches

SCALE 6:1

3.8

0.15

2.0

0.079

6.3

0.248

2.3

0.091

2.3

0.091

2.0

0.079

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.50

1.63

1.75

0.060

INCHES

A1

0.02

0.06

0.10

0.001

b

0.60

0.75

0.89

0.024

b1

2.90

3.06

3.20

0.115

c

0.24

0.29

0.35

0.009

D

6.30

6.50

6.70

0.249

E

3.30

3.50

3.70

0.130

e

2.20

2.30

2.40

0.087

0.85

0.94

1.05

0.033

0.064

0.068

0.002

0.004

0.030

0.035

0.121

0.126

0.012

0.014

0.256

0.263

0.138

0.145

0.091

0.094

0.037

0.041

NOM

MAX

L1

1.50

1.75

2.00

0.060

6.70

7.00

7.30

0.264

0.069

0.078

0.276

0.287

−

−

e1

0

°

10°

0

°

10°

q

q

L

L

0.20

−−−

−−−

0.008

−−−

−−−

STYLE 3:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.