NCP57152, NCV57152

http://onsemi.com

11

PACKAGE DIMENSIONS

DFN8, 4x4

CASE 488AF

ISSUE C

NOTES:

1. DIMENSIONS AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. DETAILS A AND B SHOW OPTIONAL

CONSTRUCTIONS FOR TERMINALS.

DIM MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.25

0.35

D

4.00 BSC

D2

1.91

2.21

E

4.00 BSC

E2

2.09

2.39

e

0.80 BSC

K

0.20

−−−

L

0.30

0.50

D

B

E

C

0.15

A

C

0.15

2X

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

C

A

(A3)

A1

8X

SEATING

PLANE

C

0.08

C

0.10

e

8X

L

K

E2

D2

b

NOTE 3

1

4

5

8

8X

0.10 C

0.05 C

AB

PIN ONE

REFERENCE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8X

0.63

2.21

2.39

8X

0.80

PITCH

4.30

0.35

L1

DETAIL A

L

OPTIONAL

CONSTRUCTIONS

A1

A3

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

L1

−−−

0.15

DETAIL B

NOTE 4

DETAIL A

DIMENSIONS: MILLIMETERS

PACKAGE

OUTLINE

ON Semiconductor and

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