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RL0805FR-7W0R022L Datasheet(PDF) 6 Page - YAGEO Corporation |
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RL0805FR-7W0R022L Datasheet(HTML) 6 Page - YAGEO Corporation |
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6 / 8 page  Chip Resistor Surface Mount www.yageo.com Aug 27, 2008 V.2 Product specification 6 8 SERIES 0805/1206 (RoHS Compliant) RL-High power TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Life/ Operational Life/ Endurance MIL-STD-202G-method 108A IEC 60115-1 4.25.1 JIS C 5202-7.10 1,000 hours at 70±5 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required ±2% High Temperature Exposure/ Endurance at upper category temperature MIL-STD-202G-method 108A IEC 60115-1 4.25.3 JIS C 5202-7.11 1,000 hours at maximum operating temperature depending on specification, unpowered No direct impingement of forced air to the parts Tolerances: 125±3 °C ±1% Moisture Resistance MIL-STD-202G-method 106F IEC 60115-1 4.24.2 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts Measurement at 24±2 hours after test conclusion ±2% Thermal Shock MIL-STD-202G-method 107G -55/+125 °C Note: Number of cycles required is 300. Devices unmounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air ±1% Short time overload MIL-R-55342D-para 4.7.5 IEC60115-1 4.13 2.5 times RCWV or maximum overload voltage whichever is less for 5 sec at room temperature ±2% No visible damage Board Flex/ Bending IEC60115-1 4.33 Device mounted on PCB test board as described, only 1 board bending required 3 mm bending Bending time: 60±5 seconds Ohmic value checked during bending ±1% No visible damage Table 4 Test condition, procedure and requirements |
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