UCC25600

SLUS846B

– SEPTEMBER 2008 – REVISED JULY 2011

www.ti.com

ORDERING INFORMATION

PART NUMBER

PACKAGE

OPERATING TEMPERATURE

UCC25600D

8-Pin SOIC

-40

°C to 125°C

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3) (4)

over operating free-air temperature range (unless otherwise noted)

PARAMETER

LIMIT

UNIT

Supply voltage, VCC

22

V

Voltage, GD1, GD2

-0.5 to VCC + 0.5

Gate drive current

– continuous, GD1, GD2

+/- 25

Current, RT

-5

mA

Current, DT

-0.7

−40 to 125

−65 to 150

°C

Lead temperature (10 seconds)

260

(1)

These are stress limits. Stress beyond these limits may cause permanent damage to the device. Functional operation of the device at

these or any conditions beyond those indicated under RECOMMENDED OPERATING CONDITIONS is not implied. Exposure to

absolute maximum rated conditions for extended periods of time may affect device reliability.

(2)

All voltages are with respect to GND.

(3)

All currents are positive into the terminal, negative out of the terminal.

(4)

In normal use, terminals GD1 and GD2 are connected to an external gate driver and are internally limited in output current.

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

PARAMETER

RATING

UNIT

Human Body Model (HBM)

2,000

V

Charged Device Model (CDM)

500

DISSIPATION RATINGS

THERMAL IMPEDANCE,

PACKAGE

JUNCTION-TO-AMBIENT

8-Pin SOIC

150

(1)

Thermal resistance is a strong function of board construction and layout. Air flow will reduce thermal resistance. This number is only a

general guide.

(2)

Thermal resistance calculated with a low-K methodology.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MINIMUM

MAXIMUM

UNIT

VCC input voltage from a low-impedance source

11.5

18.0

V

RT resistance

1

8.666

k

Ω

DT resistance

3.3

39

SS capacitor

0.01

1

μF

2

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