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EP1AGX20C Datasheet(PDF) 34 Page - Altera Corporation |
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EP1AGX20C Datasheet(HTML) 34 Page - Altera Corporation |
34 / 36 page Page 34 Package Enhanced Configuration (EPC) Devices Datasheet January 2012 Altera Corporation Package Layout Recommendation Sharp flash-based EPC16 and EPC8 devices in the 100-pin PQFP packages have different package dimensions than other Altera 100-pin PQFP devices (including the Micron flash-based EPC4 and Intel flash-based EPC16, EPC8, and EPC4). Figure 9 shows the 100-pin PQFP PCB footprint specifications for EPC devices that allows vertical migration between all devices. These footprint dimensions are based on vendor-supplied package outline diagrams. f For more information about package outline drawings, refer to the Package and Thermal Resistance page. Figure 9. EPC Device PCB Footprint Specifications for 100-Pin PQFP Packages (1), (2) Notes to Figure 9: (1) Used 0.5-mm increase for front and back of nominal foot length. (2) Used 0.3-mm increase to maximum foot width. 2.4 mm 0.65-mm Pad Pitch 0.410 mm 0.325 mm 25.3 mm 19.3 mm 1.0 2.0 0.5 1.5 mm |
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