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RE0402DRE101KL Datasheet(PDF) 6 Page - YAGEO Corporation |
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RE0402DRE101KL Datasheet(HTML) 6 Page - YAGEO Corporation |
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6 / 7 page  Chip Resistor Surface Mount www.yageo.com Dec 10, 2010 V.0 Product specification 6 7 SERIES RE 0402 to 1206 TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting IPC/JEDEC J-STD-002B test B Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155°C dry heat 2nd step: leadfree solder bath at 245±3°C Dipping time: 3±0.5 seconds Well tinned (≥95% covered) No visible damage - Leaching IPC/JEDEC J-STD-002B test D Leadfree solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat IEC 60068-2-58 Condition B, no pre-heat of samples. Leadfree solder, 260 °C, 10 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ±(1%+0.05 Ω) No visible damage TYPE RE0402 RE0603 RE0805 RE1206 Specification (mm) 5 3 3 2 Table 5 Bending for sizes 0402 to 1206 |
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