Chip Resistor Surface Mount

Product specification

4

8

SERIES

0805/1206 (RoHS Compliant)

RC-High ohmic

www.yageo.com

Dec 31, 2008 V.0

MARKING

RC0805/1206

E-24 series: 3 digits

First two digits for significant figure and 3rd digit for number of zeros

For further marking information, please see special data sheet “Chip resistors marking”.

Fig. 1

Value=100 MΩ

YNSC070

0

overcoat

Primary glass layer

resistive layer

inner electrode

termination(Ni/matte tin)

ceramic substrate

H

I2

YNSC066-1

overcoat

W

L

marking layer

Fig. 2 Chip resistor outlines

O

S

For dimension see Table 1

CONSTRUCTION

The resistor is constructed on top of a high-grade

ceramic body. Internal metal electrodes are added on

each end to make the contacts to the thick film resistive

element. The composition of the resistive element is a

noble metal imbedded into a glass and covered by a

second glass to prevent environment influences. The

resistor is laser trimmed to the rated resistance value.

The resistor is covered with a protective epoxy coat,

finally the two external terminations (matte tin on Ni-

barrier) are added. See fig. 2.

DIMENSIONS

TYPE

L (mm) W (mm)

H (mm)

RC0805 2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20

RC1206 3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20

Table 1 For outlines see fig. 2