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EHHD006A0B41Z Datasheet(PDF) 11 Page - Lineage Power Corporation

Part No. EHHD006A0B41Z
Description  EHHD006A0B Series (Eighth-Brick) DC-DC Converter Power Modules
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Maker  LINEAGEPOWER [Lineage Power Corporation]
Homepage  http://www.lineagepower.com
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EHHD006A0B41Z Datasheet(HTML) 11 Page - Lineage Power Corporation

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Data Sheet
August 29, 2011
EHHD006A0B Series Eighth-Brick Power Modules
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER
11
(CP) connectors. Figure 22 shows the new CP
connector before and after reflow soldering onto the
end-board assembly. The CP is constructed from a
solid copper pin with an integral solder ball attached,
which is composed of tin/lead (Sn/Pb) solder for non-
Z codes, or Sn/Ag3/Cu (SAC) solder for –Z codes.
EHHD Board
Insulator
Solder Ball
End assembly PCB
Figure 22. Column Pin Connector Before and After
Reflow Soldering.
The CP connector design is able to compensate for
large amounts of planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183°C (Sn/Pb solder) or 217-218°C (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. The
following instructions must be observed when SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Tin Lead Soldering
The EHHD006A0B power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process,
peak reflow temperatures are limited to less than
235°C. Typically, the eutectic solder melts at 183°C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering, the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Lead Free Soldering
The –Z version of the EHHD006A0B modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
REFLOW TIME (S)
Figure 23. Reflow Profile for Tin/Lead (Sn/Pb)
process
Figure 24. Time Limit Curve Above 205
oC for
Tin/Lead (Sn/Pb) process
Pb-free Reflow Profile
Power systems will comply with J-STD-015 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 25.
0
50
100
150
200
250
300
Preheat zone
max 4oCs-1
Soak zo ne
30-240s
Heat zone
max 4oCs-1
Peak Temp 235oC
Coo ling
zone
1-4oCs-1
T
lim above
205oC
200
205
210
215
220
225
230
235
240
0
10
203040
5060


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