 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
EHHD006A0B41Z Datasheet(PDF) 11 Page - Lineage Power Corporation |
|
||||||||||||||||||||||||||||||
EHHD006A0B41Z Datasheet(HTML) 11 Page - Lineage Power Corporation |
|
|
11 / 19 page 
Data Sheet August 29, 2011 EHHD006A0B Series Eighth-Brick Power Modules 18 - 75Vdc Input; 12V/6Adc Output LINEAGE POWER 11 (CP) connectors. Figure 22 shows the new CP connector before and after reflow soldering onto the end-board assembly. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non- Z codes, or Sn/Ag3/Cu (SAC) solder for –Z codes. EHHD Board Insulator Solder Ball End assembly PCB Figure 22. Column Pin Connector Before and After Reflow Soldering. The CP connector design is able to compensate for large amounts of planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183°C (Sn/Pb solder) or 217-218°C (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. Tin Lead Soldering The EHHD006A0B power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process, peak reflow temperatures are limited to less than 235°C. Typically, the eutectic solder melts at 183°C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering, the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. Lead Free Soldering The –Z version of the EHHD006A0B modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. REFLOW TIME (S) Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process Figure 24. Time Limit Curve Above 205 oC for Tin/Lead (Sn/Pb) process Pb-free Reflow Profile Power systems will comply with J-STD-015 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 25. 0 50 100 150 200 250 300 Preheat zone max 4oCs-1 Soak zo ne 30-240s Heat zone max 4oCs-1 Peak Temp 235oC Coo ling zone 1-4oCs-1 T lim above 205oC 200 205 210 215 220 225 230 235 240 0 10 203040 5060 |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
