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EHHD006A0B41Z Datasheet(PDF) 12 Page - Lineage Power Corporation

Part No. EHHD006A0B41Z
Description  EHHD006A0B Series (Eighth-Brick) DC-DC Converter Power Modules
Download  19 Pages
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Maker  LINEAGEPOWER [Lineage Power Corporation]
Homepage  http://www.lineagepower.com
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EHHD006A0B41Z Datasheet(HTML) 12 Page - Lineage Power Corporation

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Data Sheet
August 29, 2011
EHHD006A0B Series Eighth-Brick Power Modules
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER
12
Figure 25. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The EHHD006A0B modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of
 30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages is a minimum of 12 months from the bag
seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Pe r J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Se conds
*Time Above 217°C
60 Seconds
Cooling
Zone


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