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SMAPD Datasheet(PDF) 3 Page - Central Semiconductor Corp |
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SMAPD Datasheet(HTML) 3 Page - Central Semiconductor Corp |
3 / 3 page Material Composition Specification SMA Case Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67.9 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% www.centra lsemi.com R4 (3-June 2011) Component Material Material Substance CAS No. Substance (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 1.12% 0.76 Si 7440-21-3 1.12% 0.76 11,193 leadframe copper 40.64% 27.59 Cu 7440-50-8 40.64% 27.59 406,351 die attach high temperature solder paste 3.31% 2.25 Pb 7439-92-1 3.06% 2.081 30,649 Sn 7440-31-5 0.17% 0.113 1,664 Ag 7440-22-4 0.08% 0.056 825 encapsulation* EMC 54.04% 36.69 silica 7631-86-9 36.75% 24.95 367,468 epoxy resin 29690-82-2 10.81% 7.338 108,075 phenol resin 9003-35-4 5.4% 3.669 54,038 Sb2O3 1309-64-4 0.54% 0.367 5,405 Br 7726-95-6 0.54% 0.367 5,405 EMC GREEN 54.04% 36.69 silica (fused) 60676-86-0 41.61% 28.253 416,116 epoxy resin 29690-82-2 5.4% 3.669 54,038 phenol resin 9003-35-4 5.24% 3.559 52,418 carbon black 1333-86-4 0.16% 0.11 1,620 metal hydroxide 1309-42-8 1.62% 1.1 16,201 plating** tin/lead process 0.89% 0.61 Sn 7440-31-5 0.71% 0.485 7,143 Pb 7439-92-1 0.18% 0.121 1,782 matte tin 0.89% 0.61 Sn 7440-31-5 0.89% 0.606 8,925 *EMC GREEN molding compound is Halogen-Free. **For Lead Free plating, add suffix “LEAD FREE” to part number. For Tin/Lead plating, add suffix “TIN/LEAD” to part number. No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. |
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