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LM2676S-3.3 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2676S-3.3 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 35 page LM2676 SNVS031J – APRIL 2000 – REVISED APRIL 2013 www.ti.com All Output Voltage Versions Electrical Characteristics Limits appearing in bold type face apply over the entire junction temperature range of operation, −40°C to 125°C. Specifications appearing in normal type apply for TA = TJ = 25°C. Unless otherwise specified VIN=12V for the 3.3V, 5V and Adjustable versions and VIN=24V for the 12V version. Symbol Parameter Conditions Typ Min Max Units DEVICE PARAMETERS IQ Quiescent Current VFEEDBACK = 8V 4.2 6 mA For 3.3V, 5.0V, and ADJ Versions VFEEDBACK = 15V For 12V Versions ISTBY Standby Quiescent ON/OFF Pin = 0V 50 100/150 μA Current ICL Current Limit 4.5 3.8/3.6 5.25/5.4 A IL Output Leakage VIN = 40V, ON/OFF Pin = 0V μA Current VSWITCH = 0V 200 mA VSWITCH = −1V 16 15 RDS(ON) Switch On- ISWITCH = 3A 0.15 0.17/0.29 Ω Resistance fO Oscillator Measured at Switch Pin 260 225 280 kHz Frequency D Duty Cycle Maximum Duty Cycle 91 % Minimum Duty Cycle 0 % IBIAS Feedback Bias VFEEDBACK = 1.3V 85 nA Current ADJ Version Only VON/OFF ON/OFF Threshold 1.4 0.8 2.0 V Voltage ION/OFF ON/OFF Input ON/OFF Input = 0V 20 45 μA Current θJA Thermal NDZ Package, Junction to Ambient(1) 65 Resistance θJA NDZ Package, Junction to Ambient(2) 45 θJC NDZ Package, Junction to Case 2 θJA KTW Package, Junction to Ambient(3) 56 °C/W θJA KTW Package, Junction to Ambient(4) 35 θJA KTW Package, Junction to Ambient(5) 26 θJC KTW Package, Junction to Case 2 ++ θJA NHM Package, Junction to Ambient(6) 55 °C/W θJA NHM Package, Junction to Ambient(7) 29 (1) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area. (2) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads. (3) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.136 square inches (the same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper. (4) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. (5) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made Simple® software. (6) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area equal to the die attach paddle. (7) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area using 12 vias to a second layer of copper equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187 at www.ti.com/lsds/ti/analog/powermanagement/power_portal.page. 4 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2676 |
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