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PCF8583P Datasheet(PDF) 28 Page - NXP Semiconductors |
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PCF8583P Datasheet(HTML) 28 Page - NXP Semiconductors |
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28 / 37 page 
PCF8583 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 6 October 2010 28 of 37 NXP Semiconductors PCF8583 Clock and calendar with 240 x 8-bit RAM Fig 26. Package outline SOT662-1 (HVQFN20) of PCF8583BS 0.65 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.1 4.9 Dh 3.25 2.95 y1 5.1 4.9 3.25 2.95 e1 2.6 e2 2.6 0.38 0.23 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT662-1 MO-220 - - - - - - 0.75 0.50 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT662-1 HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 610 20 16 15 11 5 1 X D E C B A e2 terminal 1 index area terminal 1 index area 01-08-08 02-10-22 A C C B v M w M E(1) D(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. |
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