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PCF8583P Datasheet(PDF) 19 Page - NXP Semiconductors

Part No. PCF8583P
Description  Clock and calendar with 240 x 8-bit RAM
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCF8583P Datasheet(HTML) 19 Page - NXP Semiconductors

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PCF8583
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 06 — 6 October 2010
19 of 37
NXP Semiconductors
PCF8583
Clock and calendar with 240 x 8-bit RAM
9.
Limiting values
[1]
Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114”.
[2]
Pass level; Machine Model (MM), according to Ref. 6 “JESD22-A115”.
[3]
Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the NXP store and transport requirements (see Ref. 9 “NX3-00092”) the devices have to be
stored at a temperature of +8
°C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
−0.8
+7.0
V
IDD
supply current
-
50
mA
ISS
ground supply current
-
50
mA
VI
input voltage
−0.8
VDD + 0.8
V
II
input current
-
10
mA
IO
output current
-
10
mA
Ptot
total power dissipation
-
300
mW
Po
output power
-
50
mW
VESD
electrostatic discharge
voltage
HBM
[1]
-
±3000
V
MM
[2]
-
±200
V
Ilu
latch-up current
[3]
-
100
mA
Tstg
storage temperature
[4]
−65
+150
°C
Tamb
ambient temperature
operating device
−40
+85
°C


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